View Details:
Item:TH-703
Softening point:110+/-5℃
Viscosity:12300+/-2500mPa.s 170℃
Application purpose:Bonding and Fixing of Electronic Products
Item:TH-703
Softening point:110+/-5℃
Viscosity:12300+/-2500mPa.s 170℃
Application purpose:Bonding and Fixing of Electronic Products